AIDL logo
AIDL concept
AIDL concept

Agile
Integrated
Device
Laboratory

AIDL is the latest technological format that makes electronics "individual" and minimizes the size of modern production down to the size of a laboratory.
VITIM has divided all key intellectual and production chains of modern electronics, re-engineered them and wrapped each process into a separate mini-production format. AIDL approach combines engineering science center, crystal synthesis and mobile modular production of highly integrated microchips and "systems-in-package" on "chip".

A new format of microelectronics

The AIDL format, which translates to Agile Integrated Device Laboratory, is the latest technological format that makes microelectronics "individual" and minimizes the size of modern production down to the size of a compact mini-laboratory.
Functional diagram of AIDL approach
IP-module development
IP-module development & adaptation

Design of IP-modules based on the design and technical basis of vacuum electronics and combined approach (vacuum + semiconductor electronics)

IP-module re-engineering

Engineering center
Engineering center

Design and technological development of chips

IP-tuning & chip re-engineering

Creation of fully functional modern devices in a single SiP package (System-In-Package), SoC (System-on-Chip)

Neuromorphic artificial intelligence (AI) systems

Foundry production
Foundry - chip production

Foundry - custom chip production

Mass production of own products

Manufacture of experimental and pilot batches

Testing in a testing laboratory

Distribution
Distribution

Comprehensive operational supply and sale of minimalFab installations to customers (within the Territory), as well as supply of all related consumable materials

Sale and supply of technologies (crystal synthesis, comprehensive production solutions "turnkey")

"FOUNDRY", but not "FAB"
Mobile microelectronic production
Yokogawa logo
minimalFab installation

AIDL approach combines research and engineering centers, design center, growth and processing of high-quality crystals and a flexible production line for manufacturing chips for "systems-on-chip" and "systems-in-package".

minimalFab is a complex of compact technological installations 30 centimeters wide that allow processing 0.5 inch diameter substrates and promptly producing various chips in small batches. Each technological process of chip manufacturing is implemented on a separate minimalFab installation. The time for substrate processing on one installation is not more than 60 seconds. The installations are connected to each other by a robot manipulator, which transports plates in hermetic containers "Minimal Shuttle". Minimal Shuttle eliminates the need to create "clean room" infrastructure, increases responsiveness and significantly reduces chip production costs.

The mobile laboratory-production complex AIDL VITIM allows producing microelectronic devices on Si, Ge, GaAs, SiN, SiC substrates using CMOS, MEMS, NEMS, VIS technologies and other new directions in electronic equipment development.

Minimal Shuttle container
"Minimal Shuttle" Container
The minimalFab technology uses a maskless lithography process. Substrate transportation is carried out in individual hermetic "Minimal Shuttle" containers
There is no need to manufacture photomasks and have clean rooms, which reduces production preparation time, allows for prompt modernization of IC topology and significantly reduces production costs.
Competitive advantages of AIDL Foundry
  • Individual approach
    Individual approach to customers
  • Any batch
    Any batch of order
  • Minimum time
    Minimum manufacturing time
  • Low cost
    Low cost of product manufacturing
Minimal Shuttle container
"Minimal Shuttle" Container
The minimalFab technology uses a maskless lithography process. Substrate transportation is carried out in individual hermetic "Minimal Shuttle" containers
There is no need to manufacture photomasks and have clean rooms, which reduces production preparation time, allows for prompt modernization of IC topology and significantly reduces production costs.
Demonstration of minimalFab installations operating principle
The technological process of chip creation includes installations for initial substrate processing and control, photolithographic cluster, deposition section, "dry" and "wet" etching installations for thin films, heat treatment, a complex of metrological control installations and packaging of finished chips using "Flip-chip" technology.
Substrate cleaning
Cleaning
Photolithographic process
Photolithography
Etching and oxidation
Etching and oxidation
Chip packaging
Packaging
Finished microchip
The technological process provides substrate cleaning operations in organic solvents, in alkaline and acidic media
The lithographic process consists of substrate pre-wet cleaning operation, photoresist application, maskless exposure, development, plasma etching and photoresist removal
High-temperature processes of laser, infrared, thermal processes in vacuum and under pressure are used
The final stage of microelectronic production, during which a semiconductor crystal is installed in a package
Substrate cleaning
Cleaning
The technological process provides substrate cleaning operations in organic solvents, in alkaline and acidic media
Photolithographic process
Photolithography
The lithographic process consists of substrate pre-wet cleaning operation, photoresist application, maskless exposure, development, plasma etching and photoresist removal
Etching and oxidation
Etching and oxidation
High-temperature processes of laser, infrared, thermal processes in vacuum and under pressure are used
Chip packaging
Packaging
The final stage of microelectronic production, during which a semiconductor crystal is installed in a package
Finished microchip